Wafer Processing Services

Wafer Processing Services

SVTC's Wafer Processing Services provide next-generation test wafers to equipment and materials suppliers. By providing an extensive product line with high standards, SVTC offers customers access to the latest materials and structures they need to solve complex development issues. SVTC's Wafer Processing Services helps drive new tool, material and process development.

Services include:

  • Custom wafer processing with more than 4,000 different 200 mm and 300 mm process flows to build from.
  • Affordable access to advanced tools and tool expertise, while protecting customers' IP.
  • A variety of low-k wafers with k-values ranging from 2.2 porous spin-on materials to 2.8k CVD low-k materials.
  • 193 nm high NA lithography for leading-edge patterning as small as 100 nm dense lines or 130 nm contacts.
  • State-of-the-art 300 mm interconnect copper module:
    • 300 mm blanket copper wafers.
    • 300 mm patterned copper wafers for CMP, etch, cleans development.
  • Parametric bias temperature stress and ramp voltage breakdown testing available on 200 mm and 300 mm wafers.
  • 454/888N CoMPetitor™ advanced test reticle for chemical-mechanical polishing (CMP) – the ideal test vehicle for helping tool-makers and consumable suppliers stay ahead of the competition. With 100 nm line spaces, the 4545/888N has the smallest feature sizes available on a CMP reticle, and is available on both 200 mm and 300 mm wafers. The 888N CoMPetitor is available and orders are being accepted.
  • High-Konfidence™ high-k gate films for 200 mm and 300 mm wafers produced by atomic layer deposition (ALD). SVTC's advanced gate tool set provides its customers with immediate, next-generation film capability.
  • NextGate™ ALD and PVD materials for metal gate electrode compatible with high-k gate films. NextGate materials, based primarily on compounds of hafnium, tantalum, and titanium, will enable the next breakthrough in leading-edge transistor technology.

SVTC's Wafer Processing Services are used for CMP, Etch, Cleans and Fills include: