San Jose, California

At SVTC's San Jose, Calif., facility, customers can leverage a 27,000-square foot Class 10 clean room facility, a full process line of rigorously supported 8-inch tools and innovative processing capabilities. In its continuing expansion of processing capabilities and requisite new tools based on industry and customer needs, SVTC is committed to emerging markets and rapid development and commercialization of innovative technologies.

SVTC's 8-inch (200 mm) San Jose development foundry offers more than 70 process, metrology and analytical tools; a Process Library with more than 500 recipes; and aluminum (Al) back-end. Additionally, the San Jose facility is 65 nm capable using 193 nm ASML XT1250.

SVTC's San Jose fab provides:

• Photo process lithography, including 193 nm, 248 nm and I-line
• Dry etch (silicon etch, dielectric etch, metal and novel metal etch)
• Deep trench Si etch/Deep Reactive Ion Etch (DRIE)
• Front-end and back-end plasma resist strip
• Atomic Layer Deposition (ALD)
• Diffusion (including SiGe deposition)
• Chemical Vapor Deposition (amorphous Si, poly, doped amorphous, poly Si; low-pressure chemical vapor deposition; ONO)
• Wet etch/clean
• Rapid Thermal Process (RTP)
• Thin Films (including PECVD for W, Si, oxide and nitride; PVD for Ti and metal)
• CMP (blanket poly; oxide/nitride stop; blanket oxide; tungsten; low-temperature Ox, nitride and tungsten polish)
• Metrology (e.g., Epi doping, dielectric and implanter monitor, thin-film thickness and composition, stress, dopant and contamination concentration, SEM critical dimension measurements, overlay, blank and pattern wafer defect inspection, Epi/SiGe thickness, metal thickness)