Austin, Texas, Fab

Austin, Texas

At SVTC's Austin, Texas, facility (formerly ATDF), customers find a cutting-edge facility with 68,000 square feet of Class 10 clean room space. The Austin facility provides the infrastructure required to develop processes, materials and integration schemes for novel semiconductor products, including those built on 8-inch (200 mm) processes. Like SVTC’s San Jose facility, the Austin facility operates 24x7.

SVTC's Austin facility offers the most advanced set of atomic layer deposition (ALD) and metal film tools in the industry. It has more than 250 process, metrology and analytical tools, as well as a Process Library with more than 1,000 recipes. The Austin facility also handles copper (Cu) back-end and has an 85 nm transistor characterization flow.

The SVTC Austin fab includes:

  • Photo process lithography (including 193 nm; 248 nm; spin-on dielectric and other material coating; proximity print; wafer bonder alignment coat/bake/dev track for thick resist and BCB; large gap, proximity and contact printer with front-to-back alignment)
  • Dry etch (silicon, dielectric, metal, novel metal, tungsten, metal plasma, poly, DRM oxide)
  • Front-end and back-end resist ash
  • Deep trench Si etch
  • Wafer bonding
  • Front-end and back-end plasma resist strip
  • Atomic Layer Deposition (ALD)
  • Diffusion (including oxidation, atmospheric, flash anneal, metal anneal and low-k cure, high-pressure oxidation and anneal)
  • Chemical Vapor Deposition (low-pressure for amorphous Si, poly Si, TEOS, silicon nitride)
  • Wet etch/clean (including KOH etch)
  • Rapid Thermal Process (RTP)
  • Thin films (including PECVD and PVD)
  • Ion implant
  • CMP (STI oxide polish, ILD oxide, nitride, tungsten, damascene Cu and barrier, thick TSV Cu and barrier)
  • Metrology (e.g., ellipsometer dielectric, thickness, EOT measurement, dark-field wafer defect inspection, four-point probe contact resistivity, 150X inspection scope, 250X defview review and UV inspection scope, film stress and wafer bow, dopant and contamination concentration, film thickness measurement using reflectometry, inductively coupled plasma mass spectrometer, laser-based texture measurement, profiler/atomic force microscopy, wafer flatness, total reflection X-ray fluorescence spectroscopy, overlay inspection, SEM top-down CD, metal film T-opto-acoustic)
  • Wafer Processing Services focused on providing next-generation test wafers to equipment and material suppliers so they can drive new tool, material and process development (both 200 mm and 300 mm wafer processing)