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Copper, 200 mm, 000CUR000
Copper, 200 mm, 000CUR009
Copper, 200 mm, 000CUR049
Copper, 200 mm, 000CUR051
Copper, 200 mm, 000CUR071
Copper, 200 mm, 000CUR095
Copper, 200 mm, 000CUR100
Copper, 300 mm, 000CUR316
Copper, 300 mm, 000CUR317
Copper, 300 mm, 000CUR329
Copper, 300 mm, 000CUR332
Copper, 300 mm, 000CUR335
Copper, 300 mm, 000MET312
LowK, 200 mm, 000BDM000
LowK, 200 mm, 000CVD114
LowK, 300 mm, 000ULK302
Metals, 200 mm, 000CMP000
Metals, 200 mm, 000MET096
Metals, 300 mm, 000MET302
PECVD, 200 mm, 000CVD080
PECVD, 200 mm, 000CVD097
PECVD, 200 mm, 000CVD111
PECVD, 300 mm, 000CVD339
PECVD, 300 mm, 000CVD376
PECVD, 300 mm, 000CVD377
PECVD, 300 mm, 000CVD397
Thermal, 200 mm, 000DIF002
Thermal, 200 mm, 000DIF119
Thermal, 200 mm, 000DIF152
Thermal, 300 mm, 000DIF300
Thermal, 300 mm, 000DIF318
Thermal, 300 mm, 000DIF334
Thermal, 300 mm, 000DIF337
Thermal, 300 mm, 000DIF341
Interconnect Unified Reticle set for ASML 193. 130nm node.
CMP LowK and Copper Damascene Reticle
STI Test Reticle. Minimum feature size is 130nm Trench.
248nm Dual Damascene Electrical Test Reticle
Damascene/CMP Test Reticle
SAC/SALI/Bi-level
CMP LowK and Copper Damascene Reticles (MIT)
Planarization Distance Reticle
MIT STI CMP Test Reticle
MSIII Alternating Phase Shift Reticle
MSIII Phase Shift Contact Reticle
Quick Cleave Reticle - Dense and isolated lines with varying pitches, smallest line is 0.13 µm
Quick Cleave Reticle - Dense and isolated contacts with varying pitches, smallest contact is .16 µm
Quick Cleave Binary line/space poly reticle. Dense and iso lines at varying pitches
Quick Cleave Binary via reticle. Dense and iso vias at varying pitches, smallest via is 0.12 µm
248nm Dual Damascene Reticle
Dual Damascene CMP Development
Dual Damascene ETCH Development
MIT STI CMP Test Reticle
Alternating Phase Shift Reticle - Dense and isolated lines with varying pitches
Attenuated Phase Shift Reticle. Vias at varying pitches
Wafer Quantity
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Will the silicon be supplied by SVTC?
