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SVTC

Concept to Commercialization

300mm Wafers

  • All CDs and die sizes are what the mask was built to and are expressed at the wafer plane
  • The % Clear is the area coverage analysis data that is supplied by the mask shop
  • AZ = positive tone; BZ = reverse tone

400

Interconnect Unified Reticle set for ASML 193. 130nm node.

  
 
Level Bar Code CD Spec % Clear Die Size (X,Ymm)
Metal1 725A1400AZ 0.125 µm 40.61 22.4, 22.4
Via 1 750A1400AZ 0.125 µm 2.2  
Metal 2 775A1400AZ 0.125 µm 40.37  
Passivation 900A1400AZ 5.0 µm 11.78  
Pass Window 901A1400AZ 1.0 µm .21  
Reverse Pass 910A1400AZ 2.0 µm 85.91  
Bump Pass 920A1400AZ 5.0 µm 2.77  
[RFQ]

401

Quick Cleave Binary line/space poly reticle. Dense and iso lines at varying pitches

 Reticle Specs (.PDF)
 
Level Bar Code CD Spec % Clear Die Size (X,Ymm)
Poly 300A1401AZ 0.13 µm 72.51 20.0, 20.0
[RFQ]

402

Quick Cleave Binary via reticle. Dense and iso vias at varying pitches, smallest via is 0.12 µm

 Reticle Specs (.PDF)
 
Level Bar Code CD Spec % Clear Die Size (X,Ymm)
contact 700A1402AZ 0.14 µm 10.01 20.0, 20.0
[RFQ]

454

CMP LowK and Copper Damascene reticle

  
 
Level Bar Code CD Spec % Clear Die Size (X,Ymm)
Metal 1 725A1454AZ 0.10 µm 30.84 18.2, 25.8
[RFQ]

484

STI Test Reticle. Minimum feature size is 130nm Trench.

  
 
Level Bar Code CD Spec % Clear Die Size (X,Ymm)
STI 200A1484AZ 0.13 µm 45.55 20.0, 20.0
[RFQ]

700

248nm Dual Damascene Reticle

 Reticle Specs (.PDF)
 
Level Bar Code CD Spec % Clear Die Size (X,Ymm)
Metal 1 725A1700AZ 0.25 µm 43.05 22.4, 22.4
Via 750A1700AZ 0.25 µm 1.35  
Metal 2 775A1700AZ 0.25µm 42.76  
[RFQ]

754

Dual Damascene CMP Development

 Reticle Specs (.PDF)
 
Level Bar Code CD Spec % Clear Die Size (X,Ymm)
Metal 1 725A1754AZ 0.25 µm 29.21 20.36, 20.2
[RFQ]

758

Dual Damascene ETCH Development

 Reticle Specs (.PDF)
 
Level Bar Code CD Spec % Clear Die Size (X,Ymm)
Via 750A1758AZ 0.25 µm 4.27 20.0, 20.0
Metal 2 775A1758AZ 0.25 µm 18.71  
[RFQ]

764

MIT STI CMP Test Reticle

 Reticle Specs (.PDF)
 
Level Bar Code CD Spec % Clear Die Size (X,Ymm)
Zero 000A1764AZ 0.5 µm 49.7 20.0, 20.0
[RFQ]

Appendix

790

Alternating Phase Shift Reticle - Dense and isolated lines with varying pitches

 Reticle Specs (.PDF)
 
Level Bar Code CD Spec % Clear Die Size (X,Ymm)
Poly 300A1790AZ 0.12 µm ~70 20.0, 20.0
[RFQ]

792

Attenuated Phase Shift Reticle. Vias at varying pitches

 Reticle Specs (.PDF)
 
Level Bar Code CD Spec % Clear Die Size (X,Ymm)
Contact 700A1792AZ 0.20 µm ~3.5 20.0, 20.0
[RFQ]

QCD3

Quick Cleave Reticle - Dense and isolated lines with varying pitches, smallest line is 0.13 µm

 Reticle Specs (.PDF)
 
Level Bar Code CD Spec % Clear Die Size (X,Ymm)
1st QCLEV-D-B001 0.18 µm 36.8 20.0, 20.0
[RFQ]

QCE3

Quick Cleave Reticle - Dense and isolated contacts with varying pitches, smallest contact is .16 µm

 Reticle Specs (.PDF)
 
Level Bar Code CD Spec % Clear Die Size (X,Ymm)
1st QCLEV-E-B001 0.25 µm 1.67 20.0, 20.0
[RFQ]

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