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SVTC

Concept to Commercialization

200mm Wafers

  • All CDs and die sizes are what the mask was built to and are expressed at the wafer plane
  • The % Clear is the area coverage analysis data that is supplied by the mask shop
  • AZ = positive tone; BZ = reverse tone

400

Interconnect Unified Reticle set for ASML 193. 130nm node.

  
 
Level Bar Code CD Spec % Clear Die Size (X,Ymm)
Metal1 725A1400AZ 0.125 µm 40.61 22.4, 22.4
Via 1 750A1400AZ 0.125 µm 2.2  
Metal 2 775A1400AZ 0.125 µm 40.37  
Passivation 900A1400AZ 5.0 µm 11.78  
Pass Window 901A1400AZ 1.0 µm .21  
Reverse Pass 910A1400AZ 2.0 µm 85.91  
Bump Pass 920A1400AZ 5.0 µm 2.77  
[RFQ]

454

CMP LowK and Copper Damascene Reticle

  
 
Level Bar Code CD Spec % Clear Die Size (X,Ymm)
Metal 1 725A1454AZ 0.10 µm 30.84 18.2, 25.8
[RFQ]

484

STI Test Reticle. Minimum feature size is 130nm Trench.

  
 
Level Bar Code CD Spec % Clear Die Size (X,Ymm)
STI 200A1484AZ 0.13 µm 45.55 20.0, 20.0
[RFQ]

800

248nm Dual Damascene Electrical Test Reticle

 Reticle Specs (.PDF)
 
Level Bar Code CD Spec % Clear Die Size (X,Ymm)
Metal1 725B1800AZ 0.18 µm 43.05 22.4, 22.4
Via 1 750B1800AZ 0.25 µm 1.35  
Metal 2 775B1800AZ 0.18 µm 42.76  
Passivation 900B1800AZ 5.0 µm 12.62  
Reverse Pass 910B1800AZ 2.0 µm 85.38  
Bump Pass 920B1800AZ 5.0 µm 2.21  
[RFQ]

831

Damascene/CMP Test Reticle

 Reticle Specs (.PDF)
 
Level Bar Code CD Spec % Clear Die Size (X,Ymm)
Metal 1 725A1831AZ 0.35 µm 36.66 15.4, 15.4
[RFQ]

850

SAC/SALI/Bi-level

 Reticle Specs (.PDF)
 
Level Bar Code CD Spec % Clear Die Size (X,Ymm)
Poly 300A1850AZ 0.25 µm 72.8 20.0, 20.0
contact 700A1850AZ 0.25 µm 11.05  
[RFQ]

854

CMP LowK and Copper Damascene Reticles (MIT)

 Reticle Specs (.PDF)
 
Level Bar Code CD Spec % Clear Die Size (X,Ymm)
Metal 1 725B1854AZ 0.25 µm 29.22 20.36, 20.2
via 1 750A1854AZ 0.25 µm 0.24  
Metal 2 775A1854AZ 0.25 µm 31.37  
[RFQ]

862

Planarization Distance Reticle

 Reticle Specs (.PDF)
 
Level Bar Code CD Spec % Clear Die Size (X,Ymm)
contact 700A1862AZ 1.0 µm 27.23 25.0, 25.0
[RFQ]

864

MIT STI CMP Test Reticle

 Reticle Specs (.PDF)
 
Level Bar Code CD Spec % Clear Die Size (X,Ymm)
Zero 000A1864AZ 0.5 µm 49.7 20.0, 20.0
[RFQ]

Appendix

890

MSIII Alternating Phase Shift Reticle

 Reticle Specs (.PDF)
 
Level Bar Code CD Spec % Clear Die Size (X,Ymm)
Poly 300A1890AZ 0.12 µm ~52.15 32.5, 26.0
[RFQ]

892

MSIII Phase Shift Contact Reticle

 Reticle Specs (.PDF)
 
Level Bar Code CD Spec % Clear Die Size (X,Ymm)
Contact/Via 700A1892AZ 0.14 µm 6.35 32.5, 26.0
[RFQ]

QCD

Quick Cleave Reticle - Dense and isolated lines with varying pitches, smallest line is 0.13 µm

 Reticle Specs (.PDF)
 
Level Bar Code CD Spec % Clear Die Size (X,Ymm)
1st 1828-001 0.18 µm 36.8 20.0, 20.0
[RFQ]

QCE

Quick Cleave Reticle - Dense and isolated contacts with varying pitches, smallest contact is .16 µm

 Reticle Specs (.PDF)
 
Level Bar Code CD Spec % Clear Die Size (X,Ymm)
1st 1901-001 0.25 µm 1.67 20.0, 20.0
[RFQ]

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